2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

Disaggregating SoCs allows chipmakers to cram more features and functions into a package than can fit on a reticle-sized chip. But as Vidya Neerkundar, technical marketing engineer at Siemens EDA ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Blaise Santi is a recent graduate of NYU's Tisch School of the Arts majoring in Dramatic Writing. He's had experience writing not only for screen and stage, but also for sketch and late-night. His ...

I keep reading these references to Doom 1 and other 'first generation first-person shotters' as being "2.5D" To me this somehow implies they are 3-D perspective, but not quite up to today's "true 3-D" ...

Skye Automation has devised a vision systems workaround for picking parts of varying heights. The method improves picking precision using a 2D camera integrated with a robot. That’s the problem that ...

On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand. PSMC stated that major ...

This video is part of TechXchange: Chiplets - Electronic Design Automation Insights and TechXchange Talks. AMD has completed its acquisition of Xilinx, and its complementary chip-packaging technology ...