Fraunhofer ISE development also uses recyclable aluminum for masking – removing need for problem polymers. Thin copper contacts mean the silicon layer does not experience much shading. The rising ...

As the PV industry scales to annual terawatt-level production to rapidly curtail the world’s emissions, it will become more challenging to continue the cost reduction trajectory. Increasing module ...

Usually when Hackaday covers electroplating techniques, it’s to talk about through-hole PCB plating. But did you know you can use the same method to produce beautiful copper and silver crystal ...

Copper electrodeposition is a vital process in the fabrication of microelectronic interconnects, battery components and decorative coatings. By utilising carefully formulated electrolytes and ...

At the 21st International Photovoltaic Science and Engineering Conference, held on November 28 – December 2 in Fukuoka, Japan, Kaneka and imec present silver-free heterojunction silicon solar cells.

A newly published Taiwanese patent describes a powderless metal additive manufacturing concept using a TFT backplane to electrochemically print metal.

Bringing a modern PCB design together into reality is often the real test. The third part of this series offers practical ...