The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...

Electrical Function Integration places the control over exactly where components, wire, conductors and connectors are in the hands of the designer. Source: Q5D Wire harnesses are the backbone of ...

The study includes the manufacturing process of super-invar alloy of WAAM, the relationship between micro-structure and G/R, the mechanical properties and the CTE. The main transfer mode of liquid ...

Learn how the flow of costs impacts manufacturing firms, covering raw materials, work-in-process, finished goods, and cost of ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...