There are three challenges, each dealing with a critical aspect of simulation and reliability in electronic packaging. The ...

Strategic partnerships and global collaboration are required to bring advanced packaging from research to real-world impact.

Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. Preview this article 1 min The Center for Advanced Wafer ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Malaysia's semiconductor packaging and testing sector is experiencing rapid growth driven by Taiwanese and other foreign ...